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      [2010-05-15 14:21:21] Analysis On Strengh & Weakness of MF58 And MF5A

      Dear Sir/Madam,
      We, the Department of Technical Engineering (“DTE” as below), are instructed by KPD Technology Development Limited (the “Company”) to represent the best interest of the clients of the Company and provide a analysis report to you and the Company for due and careful consideration before significant investment/procurement decision to make.

        1. MF58 (Glass-sealed Series)
          1. This Series comprises a hard and solid structure with good resistance against hot temperature, which is applied to the rough environment.
          2. This Series comprises a wide accurate parameter, which is reliable, stable, responsive and highly sensitive to work under the rough environment.
          3. It is a good choice to purchase this Series given its good interchangeability, consistency, cost performance, and economical pragmatism.
          4. This Series is suitable to automated installation and mass production.
        2. MF5A(Epoxy-sealed Series)
          1. This Series contains a smaller size with fast reaction and high sensitivity.
          2. This Series is also stable and reliable to work under certain environment.
          3. This Series is easy to interchange with good consistency.
        1. MF58 Series vary its nominal resistance from 500Ω to 3.78MΩ, while MF5A Series vary from 200Ω to 200KΩ.
        2. Material factors vary from 2500 to 5000K for MF58 and from 3000 to 5000K for MF5A.
        3. Dissipation factors should be not lower than 0.8mw/℃ for MF58 and 0.7mw/℃ for MF5A.
        4. Heat constants should be no more than 7S for MF58 and 5S for MF5A.
        5. The working temperature should range from -40℃ to +300℃ for MF58 and from -40℃ to +120℃ for MF5A.
        1. The electrode and chips contained inside the glass of MF58 products experience the heating process with a temperature over 650℃ and air inside the glass is all compressed out and welded. The chips and electrode are firmly welded for great resistance against thermal shocks caused by high temperature. MF58 has a lower failure rate in its second process and records a failure rate lower than 0.001 after repeated test results over the long run.
        2. The electrode in MF5A are welded by tin in the highest temperature of 270℃ but MF5A has poor resistance against thermal shocks, particularly the components after a second process, which is easy to melt on the joint connection between the chip and the tin-welded wire and causes poor connection. Such defect rate relies on how skillful the relevant personnel are and ranges from 0.001 to 0.01.
        3. MF58 Series can be used in a low, normal, and high temperature while MF5A Series can only be used in a low and normal temperature.
        1. MF58 Series is allowed to work under rough environments while MF5A Series is not.
        2. MF58 Series is applicable to automated production while MF5A is inapplicable and will cause significant inconvenience to the mass production.
        3. Custom products of MF58 Series are used to produce thermistors with a resistance value of 3.78 MΩ while those of MF5A are only used to produce thermistors with a resistance value of 200 KΩ.
        4. Based on their product structure, MF58 Series is allowed to work in the temperature of +300℃ while MF5A Series is only allowed to work in the temperature of +120℃. In the same temperature, MF5A Series is to great extent subject to the temperature compared with MF5B.
        5. Due to different processes applied to these two Series, MF58 Series has a strong resistance against the thermal shock during its second process and is hard to become a defect, while MF5A Series will become a defect if improperly welded in their second process.

      We recommend you that MF58 Glass-sealed diode components should be used in place of MF5A Series whenever the process conditions permit.

      Yours faithfully,
      By order of the Company
      Department of Technical Engineering

      Contact: Shenzhen KPD Electronics Co., Ltd
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